Principal activities


The Egide group designs, manufactures, and sells hermetic packages to protect and interconnect several kinds of electronic or photonic chips.

The purpose of these packages is to protect integrated electronic systems or complex, and therefore fragile, chips, which are sensitive to harsh thermal, atmospheric, or magnetic environments.

These components are the product of complex expertise, drawing upon several disciplines: material structure, particularly special alloys, chemistry and surface treatment, mechanics and thermodynamics, electronics, optoelectronics, and hyper frequency modeling.

The Egide group is one of the few companies to master all of the technologies surrounding the two types of material used for these packages in the world today: glass-to-metal and ceramics.

The Egide group manufactures its own ceramics and glass beads internally.