In the plating process, a thin layer of metal is deposited on top of a metallic component in order toimprove the assembly process (soldering, wire bonding), inhibit corrosion, alter the conductivity, increase the durability of the product...

The Egide group provides state-of-the-art plating services at its manufacturing sites in the USA (San Diego CA and Cambridge, MD) and in Europe (Bollène, France). Our plating capabilities are fully integrated into the manufacturing process of our packages.


Table 1: Typical plating options at the Egide group

* Standard plating measurement points are on the seal ring & on the bonding pads (minimum surface for measurement: 0,80mm x 0,50mm - 0,030 inch x 0,020 inch).

** These are our typical plating options. Please reach out if you are interested in a chemistry not listed here.

Some Specific Plating Thickness' for can be carried out on request: please contact us with your requirements for more information

Figure 1: plated traces

Figure 2: gold plated pins on a metal frame with coaxial ceramic.


  • Egide Group uses electroless and electrolytic nickel and gold from the world's leading supplier of process chemistry.
  • Egide Group has its own wet chemistry laboratory to ensure optimal bath conditions.
  • Egide Group cross-correlates its analyses with those taken by the supplier to ensure quality.

  • Egide Group uses "standard" racks and custom designs its own racks for specific parts.
  • In-line QA is built into the standard operating practice of the plating department.
  • Egide Group has several types of barrels which are suitable for plating small parts.

  • The type of plating is selected based on product application.
  • Selective plating is achieved by a subtractive process.