Sealing, Soldering and brazing Solutions


We talk about “glass-to-metal” hermetic packages when the perfect hermetic seal of the connection pins is ensured by glass beads and about “ceramic-to-metal” hermetic packages, technology which is rarer and more difficult to achieve, when hermeticity and interconnection are ensured by ceramic inserts instead of glass beads.

Egide masters both types of hermetic sealing technologies for its GTMS packages.

Compression sealing
The reliability of the seal is guaranteed by the thermal expansion of glass and metal creating the necessary concentric compressive stress to meet stringent hermeticity requirements.

Matched sealing
This sealing process used the match of the thermal expansion coefficients of Kovar and glass over a wide temperature range. An oxide layer created between metal and glass provides for the hermeticity and electrical insulation.

Microelectronics and opto-electronics application have driven the need for more and more complex interconnection solutions.

Egide’s multilayer HTCC technology provides for innovative solutions that meet this requirement. Miniaturization of your designs is possible using the CTMS technology.
Our Alumina (Al2O3) multilayer ceramics are brazed together with complex metal housings to ensure hermeticity.

Brazing or soldering process
Using a preform of metal alloy melted at higher or lower temperature metal and ceramic components are sealed together.
Egide masters high temperature brazing and low temperature soldering.