In the world of electronics - particularly in extreme environments - High-Temperature Co-Fired Ceramic (HTCC) technology is paving the way for innovation.

This advanced ceramic technology has become indispensable across various industries, including aerospace, defense, and telecommunications, thanks to its exceptional performance and reliability.

Beyond its application in hermetic packaging, HTCC technology is extensively employed as a substrate and printed circuit board (PCB) in various advanced applications, including:

• Optical benches for telecommunications applications, where HTCC's exceptional dimensional stability, low thermal expansion, and ability to maintain precise alignment are critical for optical component positioning and long-term performance.
  
  
• Cold tables for infrared detectors, which rely on advanced technology to maintain consistently low temperatures, HTCC provides significant advantages. Its exceptional thermal conductivity and stability across wide temperature ranges make it an ideal choice for ensuring the reliable performance of these detectors.
  
  
• Multi-chip modules (MCMs) for RADAR applications, leveraging HTCC's superior electrical isolation properties, multilayer capability, complex routing, support for planar passive components, and dependable performance in high-frequency operations.

With over 40 years of expertise in HTCC and semiconductor technologies, EGIDE stands as your privileged partner in addressing the most complex technical challenges. Our commitment extends beyond simply providing solutions: we put our unique know-how and innovation capacity at the service of your most ambitious projects, in a spirit of continuous collaboration and technical excellence.