Reducing the size (and weight) and increasing the power capabilities of the ICs onboard are constant care-abouts for engineers when designing a satellite. Packages need to support increased strength of the signal (higher frequency of the signal) and to dissipate a lot of heat as the power density, for instance for GaN components, increases.

Egide has been invited to participate to the Heatpack project for both the RF and LF packages in order to solve this complex equation and to develop the next generation of low thermal resistance packages. Egide engineers are excited to participate in this project with the Heatpack partners and to bring innovative solutions together! Egide is developing these 2 packages using state-of-the-art diamond-based composite materials for an improved thermal interface management, validating along the way a new plating process for improving the hermeticity (better RGA testing), thinner & thinner leadframes for improving the RF transition in high frequency bands and for connecting precisely ICs to the package, better metal alloys to be used for brazing elements to the package.

Heatpack is a great project to showcase Egide's very special set of skills and its detailed knowledge in multiple areas such as assembly by brazing, plating, chemistry, mechanic, electronics, RF modeling and HTCC ceramics (High Temperature Cofired Ceramic, produced by Egide) for this particular satellite application with our partners especially Thales. Thanks to this unique know-how on the protection of ICs from thermal, magnetic and atmospheric environments , Egide contributes to Europe's autonomy in its supply chain for high quality hermetic solutions for sensitive aerospace components and to the competitiveness of European suppliers in these very challenging application areas.

As many if not all industries are increasing the power density on their applications and as they are facing similar challenges like a need for a better power dissipation, better RF performances, in smaller size, Egide aims at applying these honed skills to better help our customers, for applications ranging from optoelectronics to sensors.

   equipment 
• Enhanced efficiency and reliability 


   

Egide Group (Euronext ParisTM - Segment C - ISIN code : FR0000072373) is pleased to announce the completion of the renovation of its plating line at its Cambridge, Maryland facility.

This state-of-the-art facility has the capability to provide electrolytic nickel, gold, tin and copper plating services, as well as electroless nickel and gold plating services. To support these operations, new wastewater treatment equipment, laboratory analysis equipment, and environmentally friendly fume scrubbers have been installed.

4 highly specialized lines to meet all customer needs

The plating shop is sub-divided into four separate lines.

• The first line provides a process to clean various metal components such as CRS, SS, ASTM F-15, and copper alloys. This is accomplished with various alkaline and acidic chemistries.
• The second and largest line provides the following plating services: electrolytic nickel, electroless nickel, electrolytic gold and selective electrolytic gold plating.
• The third line provides electrolytic nickel, copper and tin plating. The tin plating is a pure matte finish, which may be flow brightened using an EGIDE proprietary process. 
• The fourth plating line provides electroless boron nickel and gold plating services. This specialized plating is applied to our high temperature co-fired ceramic.

Increased security and controls on all lines

The electrical rectifiers for each of the plating lines have been installed in an environmentally friendly area. This will prevent rectifier degradation and provide continuous operation with little or no maintenance.

The individual plating lines have dedicated controllers that allow operators to review the various parameters such as temperature, solution level, conductivity, etc.

Live data streamed from these controllers are accessed remotely with the use of computers or smart phones.


A new control laboratory

A new laboratory has been outfitted with wet chemical analysis equipment, as well as a new Perkin Elmer Inductively Coupled Plasma Optical Emission Spectrometer.

This equipment will ensure that the plating bath solutions, which are monitored daily, are kept within specification, and our wastewater treatment operation is compliant to local regulatory requirements.

State-of-the-art equipment

Finally, the factory has created a dedicated manufacturing area for staging and processing product from the plating shop. Included in this manufacturing area are various plating racks designed for a multitude of part geometries and two ultramodern x-ray fluorescence machines which allow technicians to monitor the plating thicknesses.

This information allows the plating technical team to establish precise process parameters meeting stringent customer requirements.

Improved productivity and delivery times

The reconstruction and modernization of the plating shop will provide a more efficient and reliable process which will better serve our customers by providing increased accuracy regarding delivery performance and enhanced delivery lead-times.

CONTACTS

Egide USA
Kirk Williamson - Director of Operations - 410 901 6224 -kwilliamson@us.egide-group.com 
John Hitch - Director of Engineering - 410 901 6211 -jhitch@us.egide-group.com

Press relations (Europe)
FIN'EXTENSO - Isabelle Aprile - +33 1 39 97 61 22 - i.aprile@finextenso.fr
    
  

In this article from EU Research (EU Research AUT21/P52), learn how Egide, with the other members of the "Heatpack" European consortium, tackles the problem of power dissipation with new packaging solutions.

IMAPS - International Microelectronics Assembly and Packaging Society - is a global community of microelectronic related engineers, scientists, manufacturers, end-users and supply chain companies. The Society aims to support the development and growth of the Microelectronics and related industries, and to aid the transfer of knowledge and information. This is achieved through networking, seminars, workshops, short courses, publications, webinars and websites. Members benefit from access to business networking and events at a reduced rate; technical information & receive society newsletters and other publications. IMAPS is the largest Microelectronic Packaging Society in the World ! IMAPS-France (French chapter) is a non-profit organization. IMAPS-France is one out of the 30 IMAPS chapters throughout the World.

Join us to the Booth #7

Reducing the size (and weight) and increasing the power capabilities of the ICs onboard are constant care-abouts for engineers when designing a satellite. Packages need to support increased strength of the signal (higher frequency of the signal) and to dissipate a lot of heat as the power density, for instance for GaN components, increases.

Egide has been invited to participate to the Heatpack project for both the RF and LF packages in order to solve this complex equation and to develop the next generation of low thermal resistance packages. Egide engineers are excited to participate in this project with the Heatpack partners and to bring innovative solutions together! Egide is developing these 2 packages using state-of-the-art diamond-based composite materials for an improved thermal interface management, validating along the way a new plating process for improving the hermeticity (better RGA testing), thinner & thinner leadframes for improving the RF transition in high frequency bands and for connecting precisely ICs to the package, better metal alloys to be used for brazing elements to the package.

Heatpack is a great project to showcase Egide's very special set of skills and its detailed knowledge in multiple areas such as assembly by brazing, plating, chemistry, mechanic, electronics, RF modeling and HTCC ceramics (High Temperature Cofired Ceramic, produced by Egide) for this particular satellite application with our partners especially Thales. Thanks to this unique know-how on the protection of ICs from thermal, magnetic and atmospheric environments , Egide contributes to Europe's autonomy in its supply chain for high quality hermetic solutions for sensitive aerospace components and to the competitiveness of European suppliers in these very challenging application areas.

As many if not all industries are increasing the power density on their applications and as they are facing similar challenges like a need for a better power dissipation, better RF performances, in smaller size, Egide aims at applying these honed skills to better help our customers, for applications ranging from optoelectronics to sensors.

   equipment 
• Enhanced efficiency and reliability 


   

Egide Group (Euronext ParisTM - Segment C - ISIN code : FR0000072373) is pleased to announce the completion of the renovation of its plating line at its Cambridge, Maryland facility.

This state-of-the-art facility has the capability to provide electrolytic nickel, gold, tin and copper plating services, as well as electroless nickel and gold plating services. To support these operations, new wastewater treatment equipment, laboratory analysis equipment, and environmentally friendly fume scrubbers have been installed.

4 highly specialized lines to meet all customer needs

The plating shop is sub-divided into four separate lines.

• The first line provides a process to clean various metal components such as CRS, SS, ASTM F-15, and copper alloys. This is accomplished with various alkaline and acidic chemistries.
• The second and largest line provides the following plating services: electrolytic nickel, electroless nickel, electrolytic gold and selective electrolytic gold plating.
• The third line provides electrolytic nickel, copper and tin plating. The tin plating is a pure matte finish, which may be flow brightened using an EGIDE proprietary process. 
• The fourth plating line provides electroless boron nickel and gold plating services. This specialized plating is applied to our high temperature co-fired ceramic.

Increased security and controls on all lines

The electrical rectifiers for each of the plating lines have been installed in an environmentally friendly area. This will prevent rectifier degradation and provide continuous operation with little or no maintenance.

The individual plating lines have dedicated controllers that allow operators to review the various parameters such as temperature, solution level, conductivity, etc.

Live data streamed from these controllers are accessed remotely with the use of computers or smart phones.


A new control laboratory

A new laboratory has been outfitted with wet chemical analysis equipment, as well as a new Perkin Elmer Inductively Coupled Plasma Optical Emission Spectrometer.

This equipment will ensure that the plating bath solutions, which are monitored daily, are kept within specification, and our wastewater treatment operation is compliant to local regulatory requirements.

State-of-the-art equipment

Finally, the factory has created a dedicated manufacturing area for staging and processing product from the plating shop. Included in this manufacturing area are various plating racks designed for a multitude of part geometries and two ultramodern x-ray fluorescence machines which allow technicians to monitor the plating thicknesses.

This information allows the plating technical team to establish precise process parameters meeting stringent customer requirements.

Improved productivity and delivery times

The reconstruction and modernization of the plating shop will provide a more efficient and reliable process which will better serve our customers by providing increased accuracy regarding delivery performance and enhanced delivery lead-times.

CONTACTS

Egide USA
Kirk Williamson - Director of Operations - 410 901 6224 -kwilliamson@us.egide-group.com 
John Hitch - Director of Engineering - 410 901 6211 -jhitch@us.egide-group.com

Press relations (Europe)
FIN'EXTENSO - Isabelle Aprile - +33 1 39 97 61 22 - i.aprile@finextenso.fr
    
  

In this article from EU Research (EU Research AUT21/P52), learn how Egide, with the other members of the "Heatpack" European consortium, tackles the problem of power dissipation with new packaging solutions.

IMAPS - International Microelectronics Assembly and Packaging Society - is a global community of microelectronic related engineers, scientists, manufacturers, end-users and supply chain companies. The Society aims to support the development and growth of the Microelectronics and related industries, and to aid the transfer of knowledge and information. This is achieved through networking, seminars, workshops, short courses, publications, webinars and websites. Members benefit from access to business networking and events at a reduced rate; technical information & receive society newsletters and other publications. IMAPS is the largest Microelectronic Packaging Society in the World ! IMAPS-France (French chapter) is a non-profit organization. IMAPS-France is one out of the 30 IMAPS chapters throughout the World.

Join us to the Booth #7