THERMAL IMAGING

Designs and manufactures packages for the thermal imaging market based upon its proven, reliable HTCC (High Temperature Co-fired Ceramic) technology.

OPTOELECTRONIC

Egide's multilayer HTCC technology together with all in-house RF simulations capabilities position us as an unique player in the high frequency packages used for TOSA/ROSA, 100Gb, 400Gb and modulator designs.

POWER PACKAGES

Using Glass to Metal Seal ( GTMS) or Ceramic to Metal Seal (CTMS) feed thru technology to provide standard product form types, (TO-254, TO-257,?) or custom designed packages used in Hybrid Circuits, Power converters, switch mode power supplies, etc., for military, aeronautics and space applications.

MICROWAVE/RF

Designs and manufactures a wide variety of RF packages for avionics, military and communications markets.