Reducing the size (and weight) and increasing the power capabilities of the ICs onboard are constant care-abouts for engineers when designing a satellite. Packages need to support increased strength of the signal (higher frequency of the signal) and to dissipate a lot of heat as the power density, for instance for GaN components, increases.

Egide has been invited to participate to the Heatpack project for both the RF and LF packages in order to solve this complex equation and to develop the next generation of low thermal resistance packages. Egide engineers are excited to participate in this project with the Heatpack partners and to bring innovative solutions together! Egide is developing these 2 packages using state-of-the-art diamond-based composite materials for an improved thermal interface management, validating along the way a new plating process for improving the hermeticity (better RGA testing), thinner & thinner leadframes for improving the RF transition in high frequency bands and for connecting precisely ICs to the package, better metal alloys to be used for brazing elements to the package.

Heatpack is a great project to showcase Egide's very special set of skills and its detailed knowledge in multiple areas such as assembly by brazing, plating, chemistry, mechanic, electronics, RF modeling and HTCC ceramics (High Temperature Cofired Ceramic, produced by Egide) for this particular satellite application with our partners especially Thales. Thanks to this unique know-how on the protection of ICs from thermal, magnetic and atmospheric environments , Egide contributes to Europe's autonomy in its supply chain for high quality hermetic solutions for sensitive aerospace components and to the competitiveness of European suppliers in these very challenging application areas.

As many if not all industries are increasing the power density on their applications and as they are facing similar challenges like a need for a better power dissipation, better RF performances, in smaller size, Egide aims at applying these honed skills to better help our customers, for applications ranging from optoelectronics to sensors.

Egide USA, a subsidiary of Groupe Egide (Euronext Paris - ISIN code: FR0000072373) today announced it won a Gold Tier Award for exceptional performance and contributions to supply chain success in 2019 for BAE Systems? Electronic Systems sector. Egide USA was selected from a pool of more than 2,200 suppliers that worked with the sector in 2019.

Egide group continues its progression towards sustainable profitable growth, showing resilience to the COVID crisis and the industrial fire at the Cambridge facility.

Creation of a Business Development team with the appointment of two experts, to strengthen its sales and marketing operations in the United States and Europe

Egide announces that its 2020 Universal Registration Document has been submitted to the AMF (Autorité des Marchés Financiers) on June 2, 2021 under the registration number D.21-0505.

This press release is available only in French.

1st half 2021 revenue was €16,59 m: + 30.7% compared to S2 2020

Egide Group is pleased to announce the completion of the renovation of its plating line at its Cambridge, Maryland facility. This state-of-the-art facility has the capability to provide electrolytic nickel, gold, tin and copper plating services, as well as electroless nickel and gold plating services. To support these operations, new wastewater treatment equipment, laboratory analysis equipment, and environmentally friendly fume scrubbers have been installed.

Reducing the size (and weight) and increasing the power capabilities of the ICs onboard are constant care-abouts for engineers when designing a satellite. Packages need to support increased strength of the signal (higher frequency of the signal) and to dissipate a lot of heat as the power density, for instance for GaN components, increases.

Egide has been invited to participate to the Heatpack project for both the RF and LF packages in order to solve this complex equation and to develop the next generation of low thermal resistance packages. Egide engineers are excited to participate in this project with the Heatpack partners and to bring innovative solutions together! Egide is developing these 2 packages using state-of-the-art diamond-based composite materials for an improved thermal interface management, validating along the way a new plating process for improving the hermeticity (better RGA testing), thinner & thinner leadframes for improving the RF transition in high frequency bands and for connecting precisely ICs to the package, better metal alloys to be used for brazing elements to the package.

Heatpack is a great project to showcase Egide's very special set of skills and its detailed knowledge in multiple areas such as assembly by brazing, plating, chemistry, mechanic, electronics, RF modeling and HTCC ceramics (High Temperature Cofired Ceramic, produced by Egide) for this particular satellite application with our partners especially Thales. Thanks to this unique know-how on the protection of ICs from thermal, magnetic and atmospheric environments , Egide contributes to Europe's autonomy in its supply chain for high quality hermetic solutions for sensitive aerospace components and to the competitiveness of European suppliers in these very challenging application areas.

As many if not all industries are increasing the power density on their applications and as they are facing similar challenges like a need for a better power dissipation, better RF performances, in smaller size, Egide aims at applying these honed skills to better help our customers, for applications ranging from optoelectronics to sensors.

Egide USA, a subsidiary of Groupe Egide (Euronext Paris - ISIN code: FR0000072373) today announced it won a Gold Tier Award for exceptional performance and contributions to supply chain success in 2019 for BAE Systems? Electronic Systems sector. Egide USA was selected from a pool of more than 2,200 suppliers that worked with the sector in 2019.

Egide group continues its progression towards sustainable profitable growth, showing resilience to the COVID crisis and the industrial fire at the Cambridge facility.

Creation of a Business Development team with the appointment of two experts, to strengthen its sales and marketing operations in the United States and Europe

Egide announces that its 2020 Universal Registration Document has been submitted to the AMF (Autorité des Marchés Financiers) on June 2, 2021 under the registration number D.21-0505.

This press release is available only in French.

1st half 2021 revenue was €16,59 m: + 30.7% compared to S2 2020

Egide Group is pleased to announce the completion of the renovation of its plating line at its Cambridge, Maryland facility. This state-of-the-art facility has the capability to provide electrolytic nickel, gold, tin and copper plating services, as well as electroless nickel and gold plating services. To support these operations, new wastewater treatment equipment, laboratory analysis equipment, and environmentally friendly fume scrubbers have been installed.