Coherent optical networks can provide larger transmission capacity and much distance up to 100 times mor than non-coherent networks (thousands Km for coherent versus tens Km for non-coherent). Coherent modulators are vital components for such high-speed coherent communication networks.

Since these coherent modulators, like most microelectronic modules, need to be hermetically packaged, the optical internetworking forum (OIF) has introduced the specifications of high-bandwidth coherent driver modulator (HB-CDM) package.

Radio frequency (RF) performance for such packages plays a key role in module performance.

Multi layers high temperature co-fired ceramic (HTCC) provides high capabilities in terms of electrical routing density for tracks and vertical vias. According to the package surface-mount technology (SMT), we present the performance of two RF transition designs, first one called vertical transition up to 50 GHz (RF vertical vias through 13-14 HTCC layers) for packages with lead-frame SMT, and second design called coplanar transition up to 80 GHz (planar RF transmission lines without RF vertical vias) for flex printed circuit bord (F-PCB) SMT.


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